Efficient Heat Dissipation for Electronic Systems
Electronic components generate significant heat during continuous operation. We have been manufacturing thermal management components since 2011 and have supplied control cabinet housings for Sany Heavy Industry. Their control and electronic systems operate under high thermal loads, requiring reliable heat dissipation solutions.
This Heat Sink Housing is used in industrial control modules, power drive systems, communication equipment, and high-precision electronic assemblies. It is designed to efficiently transfer heat away from sensitive components while also providing protection against dust and mechanical vibration.
Materials include 6063 and 6061 aluminum alloys, die-cast aluminum, and copper alloy, selected for high thermal conductivity and structural stability.
Thermal and Mechanical Performance Data
Flatness is controlled within ≤0.02 mm per 100 mm to ensure proper thermal contact and assembly precision.
Hole position tolerance is maintained within ≤0.03 mm for accurate installation of electronic components.
Thermal conductivity ranges from 180 to 220 W/(m·K), ensuring efficient heat transfer and stable thermal performance.
Protection rating ranges from IP54 to IP65, providing resistance against dust ingress and water splashes.
Operating temperature range is -40°C to 120°C, suitable for both low-temperature environments and high-heat electronic operation.
Surface roughness is controlled at Ra ≤ 0.8–3.2 μm to optimize heat transfer and surface treatment performance.
Surface finishes include anodizing, sandblasting, powder coating, and passivation to enhance corrosion resistance and durability.
Integrated Cooling Housing for Electronic and Power Systems
We do not only manufacture housings-we provide complete thermal protection solutions for electronic systems.
This Heat Sink Housing is widely used in industrial computer enclosures, driver housings, power module casings, and communication equipment cooling structures.
It is suitable for control modules, power drives, communication devices, and other heat-sensitive electronic systems requiring stable long-term operation.
With over a decade of manufacturing experience since 2011, we focus on delivering high-efficiency thermal management housings that ensure reliability and performance in demanding environments.
Core Parameters
|
Parameter |
Specification / Range |
|
Material |
6063 / 6061 Aluminum / Die-cast Aluminum / Copper Alloy |
|
Flatness |
≤0.02 mm / 100 mm |
|
Hole Position Tolerance |
≤0.03 mm |
|
Surface Roughness |
Ra ≤ 0.8–3.2 μm |
|
Thermal Conductivity |
180–220 W/(m·K) |
|
Working Temperature |
-40°C to 120°C |
|
Protection Rating |
IP54–IP65 |
|
Surface Treatment |
Anodizing / Sandblasting / Powder Coating / Passivation |
|
Application |
Industrial Computer Case / Driver Shell / Power Module Housing / Communication Equipment Cooling |
|
Standard |
Industrial Thermal Management Equipment Requirements |
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